From the Manufacturer
Key Feature

- Supports newest AMD AM3+ FX/AM3 Phenom II series processors
- Advanced 8+2 phase CPU VRM power design for AMD high-TDP CPU support
- 5 PCI-E 2.0 interfaces for 3 way AMD CrossFireX and SLI multi-graphics support
- AMD SB950 provides 6 native SATA3 ports with superfast 6Gbps link speed and RAID 0, 1, 5, 10 support
- Supports USB 3.0 with superfast transfer rates of up to 5 Gbps
- GIGABYTE 3x USB Power with On/Off Charge USB ports
- Ultra Durable 3 Technology with copper cooled quality for lower working temperature
- Turbo XHD technology accelerating hard drive performance with ease
- Revolution energy saving design with Easy Energy Saver technology
- Hi-def 108dB Signal-to-noise ratio Blu-ray DVD audio playbackt
- Patented DualBIOS with Hybrid EFI technology for 3TB HDD support
- Supports Dolby Home Theater audio
Overview
Get Ready for New Generation of 32nm AMD AM3+ CPU

Get Ready for New Generation of 32nm AMD AM3+ CPU GIGABYTE's AMD motherboards are ready to support new generation of 32nm AMD AM3+ multi-core processors, delivering the very best platform for multitasking, multimedia and high performance gaming.
Multi-display Support with 3 way SLITM and 3 way CrossFireX

Flexible graphics capabilities - Up to 3 VGA cards are supported for either 3 way CrossFireXTM or 3 way SLITM action (running at two x16 or four x8 bandwidth), delivering the ultimate in graphics performance for gaming enthusiasts who demand the highest frame rates without compromising on resolution.
Note: Please update the latest version of BIOS from GIGABYTE website and VGA driver from vender's website.
Driver MOSFETs - Integration of VRM Components

Flexible graphics capabilities - Up to 4 VGA cards are supported for either 4 way CrossFireXTM or 4 way SLITM action (running at two x16 or four x8 bandwidth), delivering the ultimate in graphics performance for gaming enthusiasts who demand the highest frame rates without compromising on resolution.
Ultra Durable 3

GIGABYTE Ultra Durable 3 design, featuring 2 ounces of copper for both the Power and Ground layers which dramatically lowers system temperature by delivering a more efficient spreading of heat from critical areas of the motherboard such as the CPU power zone throughout the entire PCB. GIGABYTE's Ultra Durable 3 also lowers the PCB impedance by 50%, which helps to reduce electrical waste and further lowers component temperatures. A 2oz Copper layer design also provides improved signal quality and lower EMI (Electromagnetic Interference), providing better system stability and allowing for greater margins for overclocking
DualBIOSTM 3TB+ HDD Support (Hybrid EFI Technology)

Hybrid EFI Technology combines the benefits of GIGABYTE's mature BIOS platform including stability and compatibility with 3rd party products with 3TB+ HDD support from EFI technology, allowing GIGABYTE to offer the best of both worlds through a quick and easy BIOS update using GIGABYTE's @BIOS utility that is freely available from the GIGABYTE website.
GIGABYTE DualBIOSTM is a patented technology that automatically recovers BIOS data when the main BIOS has crashed or failed. Featuring 2 physical BIOS ROMs integrated onboard, GIGABYTE DualBIOSTM allows quick and seamless recovery from BIOS damage or failure due to viruses or improper BIOS updating. In addition, GIGABYTE DualBIOS? now supports 3TB+ (terabyte) hard drive booting without the need for partitioning, and enables more data storage on a single hard drive.





